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SOLUTION

Thick copper plate process solution

Product Introduction and Process Features

Thick copper plates are mainly high current substrates, which are generally high-power or 
high-voltage substrates. They are commonly used in automotive electronics, 
communication equipment, aerospace, network energy, planar transformers, power 
converters, and secondary power modules. The development of thinness and 
miniaturization in electronic products urgently requires PCBs to have higher thermal 
conductivity, and the application of thin core thick copper multilayer boards is more 
widespread. The advantages of thick copper: Thick copper plates (≥ 3oz) have the ability 
to carry large currents, reduce thermal strain, and have good heat dissipation.

Etching usually 
involves etching 
twice

Special pressing 
program for 
pressing

Special resin filling treatment 
is required for 8oz or above 
(inclusive)

Welding prevention 
requirementsLine 
Mask Design

Characteristics of Thick Copper Process

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