ABOUT US

Process capability

ITEM

PROJECT

JUDGMENT CRITERIA

Process capability

BATCH

SAMPLE

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Material type

Number of layers

Plate thickness

POFV(Electroplating+vacuum resin plug hole)

Interlayer alignment

Shipping size

Pth Drill to pattern

Mechanical drilling hole diameter

Position tolerance

Aspect ratio

Through-hole

Through-hole copper

Finished line width

Finished product line spacing

Impedance value tolerance requirement 

(impedance line width<89um)

SMD minimum PITCH

Microvia Annular ring

Aperture plug hole

Solder Dam

Minimize Gold Pad Size

Minimum specification of finished product

Minimum specification of finished product

Minimum specification of finished product

Minimum specification of finished product

Minimum specification of finished product

Surface Treatment

Tin spraying 

thickness

OSP thickness

Hua Jin Jin Hou

Gold nickel thickness

Green oil

Other color oils

Minimum specification of finished product 

(outer layer)

Minimum specification of finished product 

(inner layer)

Minimum specification of finished product 

(outer layer)

Minimum specification of finished product 

(inner layer)

Minimum specification of finished product

Minimum specification of finished product

Minimum specification for workpapers

Minimum specification for working draft 

(anti welding cold hole)

Minimum working specification (vacuum 

resin plug hole)

width

width

Line spacing>75um

Line spacing>75um

Semi finished product specifications

Semi finished product specifications

Semi finished product specifications

Hole edge to hole 

edge

Hole edge to PAD

PAD to PAD

PAD to forming edge

Depressed

Pressing

Minimum specification of 

finished product

Minimum specification of 

working draft 4L

Minimum specification of 

working draft 6L-14L

Minimum specification of 

work draft>14L

Minimum aperture

Minimum specification of finished product

Minimum specification of finished product

Minimum specification of finished product

Minimum specification of finished product

Inner layer specifications

Finished product specifications

Finished product specifications

≤32

min:0.063mm T/T

0.30-3.2mm

0

+/-63um

>50*50mm

≥24.5mil

≥5.5mil

≥7mil

6mil

6mil

5mil

5mil

6mil

>8mil

>6mil

>6mil

>8mil

≤14:1

≤25um

≤20un  

≥63um

≥50um

≥63um

≥50um

≥±7%

≥8mn

≥23.5mil

35um

30um

50um

38um

50um

38um

± 5%

6mi(FLY PROBE)

3.0mil

≤0.5mm

≤23.5mil

>3.0mil

>4.0mil

≥28mil

≤35um

0.03-0.08um

3-7um

0.2-0.4um

2.5mil

3.5mil 

6mil

40un

0.1um

8um

0.5um

0.6mm

0.8mm

14:1

4mil

30*50mm

4mil

5mil

6mil

+/-50um

0

min:0.05mm T/T

3.5mm  

46

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CEM-3; FR4 Tg140: FR4 Tg150: FR4 Tg170 above: read free

Halogen free; PTFE. High frequency and high-speed materials